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During the last decade, Solid State Drives (SSDs) which are composed of multiple NAND flash chips a…
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As the process progresses, SSD costs continue to reduction. From the MLC to TLC or even the future …
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隨著積體電路製程提升,功耗效率及內部元件溝通延遲等問題日益受到重視。為解決上述問題,三維多核心架構發展日益蓬勃。然而,三維多核心架構的功率密度提升以及散熱面積縮小所引發的過熱問題使其產品化困難度提高…